this is information on a product in full production. november 2014 docid027072 rev 1 1/8 8 EMIF06-HSD04F3 6-line low capacitance ipad? for micro-sd card with emi filtering and esd protection datasheet ? production data figure 1. pin configuration (bump side) features ? very low line capacitance to compensate long pcb tracks (4.5 pf typ.) ? 208 mhz clock frequency compliant with sd3.0 uhs-1 sdr 104 standard ? high esd robustness: up to 12 kv contact ? lead-free package in 400 m pitch ? package thickness: 500 m typ. ? very low pcb space consumption ? high reliability offer by the monolithic integration complies with the following standards: ? iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) application where esd protection for sensitive equipment is required: ? smartphones and tablets ? camera, printers, laptops and desktops description the EMIF06-HSD04F3 chip is a highly integrated device designed to protect the application against esd event during the insertion of the micro-sd card. the EMIF06-HSD04F3 must be placed close to the micro-sd card connector for efficient esd protection. tm : ipad is a trademark of stmicroelectronics ) o l s & k l s e x p s v $ % & ' www.st.com
characteristics EMIF06-HSD04F3 2/8 docid027072 rev 1 1 characteristics figure 2. EMIF06-HSD04F3 schematic table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 (on pins vcc, sdclk, sdcmd, sddat0, sddat1, sddat2, sddat3 air discharge contact discharge, external pins esd discharge iec 61000-4-2, level 1 (on pins clk, dat0, dat1,dat2, dat3, cmd) air discharge contact discharge, internal pins 15 12 15 10 kv t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. pin configuration pin signal pin signal a1 dat0 c1 cmd a2 dat1 a3 sddat1 c3 gnd a4 sddat0 c4 sdcmd b1 clk d1 dat3 b2 v cc d2 dat2 b3 gnd d3 sddat2 b4 sdclk d4 sddat3
docid027072 rev 1 3/8 EMIF06-HSD04F3 characteristics figure 3. electrical characteristics (definitions) table 3. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 5 9 v i rm leakage current at v rm v rm = 3 v per line 100 na c line data line capacitance v bias = 0 v, f = 10 mhz, v osc = 30 mv 4.5 pf r1, r2, r3, r4, r5, r6 serial resistance tolerance 23% 1 r9, r10, r11, r12 pull-up resistance tolerance 20% 40 50 60 k r13 pull-up resistance on cmd tolerance 20% 12 15 18 k 6 \ p e r o 3 d u d p h w h u 9 % u h d n g r z q y r o w d j h 9 6 w d q g r i i y r o w d j h % 5 5 0 , / h d n d j h f x u u h q w d w 9 5 0 5 0 / l q h f d s d f l w d q f h & o l q h 9 , 9 & / 9 % 5 9 5 0 , 5 0 , 3 3 figure 4. attenuation versus frequency figure 5. analog crosstalk versus frequency 0 0 0 0 * * * & o n ' d w ' d w ' d w ' d w & p g 6 g % ) + ] 0 0 0 0 * * * & o n ' d w ' d w 6 ' ' d w ; 7 d o n g % ) + ]
characteristics EMIF06-HSD04F3 4/8 docid027072 rev 1 table 4. line capacitance versus voltage (typical values) figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 9 g l y 9 9 9 q v g l y 9 ( 6 ' s h d n y r o w d j h 3 3 9 & o d p s l q j y r o w d j h # q v & / 9 & o d p s l q j y r o w d j h # q v & / 9 & o d p s l q j y r o w d j h # q v & / 9 9 g l y 9 9 9 q v g l y 9 ( 6 ' s h d n y r o w d j h 3 3 9 & o d p s l q j y r o w d j h # q v & / 9 & o d p s l q j y r o w d j h # q v & / 9 & o d p s l q j y r o w d j h # q v & / 9 figure 8. digital crosstalk dat0 versus clk line (v cc = 3.9 v, r load = 1 m ? figure 9. line capacitance versus frequency 0 0 * & o n ' d w ' d w ' d w ' d w & p g & / , 1 ( s ) ) + ] 3 g % p 9 % , $ 6 9 & / , 1 ( ) 9 % , $ 6 9 ) 0 + ] 9 2 6 & p 9 7 d p e ? &
docid027072 rev 1 5/8 EMIF06-HSD04F3 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. flip-chip package dimensions figure 11. footprint recommendations figure 12. marking p p ? ? p p p ? ? p ? p ? ? p ? ? p ? ? p ? ? p ? ? p ? ? p u h f r p p h q g h g ? p u h f r p p h q g h g ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j & r s s h u s d g ' l d p h w h u 6 r o g h u p d v n r s h q l q j ? p p l q l p x p [ \ ] z [ z ' r w 6 7 o r j r ( & 2 3 $ & . v w d w x v [ [ p d u n l q j \ z z g d w h f r g h \ \ h d u z z z h h n ] p d q x i d f w x u l q j o r f d w l r q
package information EMIF06-HSD04F3 6/8 docid027072 rev 1 figure 13. tape and reel specification note: more information is available in the application notes: an2348, ?ipad? 400 m flip chip: package description and recommendations for use? an1751, ?emi filters: recommendations and measurements? an4541, ?emi filters for sd3.0 card: high speed sd card and filtering devices? ' r w l g h q w l i \ l q j 3 l q $ o r f d w l r q 8 v h u g l u h f w l r q r i x q u h h o l q j $ o o g l p h q v l r q v d u h l q p p ? ? ? ? ? ? ? ? ? ? 6 7 6 7 6 7 [ [ ] \ z z [ [ ] \ z z [ [ \ z z ( ( ( ? 6 7 6 7 6 7 [ [ ] \ z z [ [ ] \ z z ( ( (
docid027072 rev 1 7/8 EMIF06-HSD04F3 ordering information 3 ordering information figure 14. ordering information scheme 4 revision history table 5. ordering information order code marking package weight base qty delivery mode EMIF06-HSD04F3 lf flip chip 2.77 mg 5000 tape and reel (7?) ( 0 , ) + 6 ' ) ( 0 , i l o w h u 1 x p e h u r i o l q h v $ s s o l f d w l r q + 6 ' + l j k v s h h g 6 ' f d u g 9 h u v l r q ' h v l j q y h u v l r q 3 d f n d j h ) ) o l s f k l s / h d g i u h h s l w f k ? p e x p s ? p table 6. document revision history date revision changes 04-nov-2014 1 initial release
EMIF06-HSD04F3 8/8 docid027072 rev 1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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